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self-assembly WS2 Tin disulfide MoirePattern Platinum kelvin probe force microscopy Barium_titanate self_healing MeltingPoint hard_disk HanyangUniv dielectric trench gallium_nitride Hydroxyapatite BoronNitride CalciumHydroxyapatite Microchannel NUSNNI MultiferroicMaterials ScanningIon-ConductanceMicroscopy Alloy CastIron BCZT Butterfly Epoxy SFAs Film Pores ElectroDeposition SetpointMode ito_film Imprint 3-hexylthiophene Tungsten Tungsten_disulfide
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self-assembly WS2 Tin disulfide MoirePattern Platinum kelvin probe force microscopy Barium_titanate self_healing MeltingPoint hard_disk HanyangUniv dielectric trench gallium_nitride Hydroxyapatite BoronNitride CalciumHydroxyapatite Microchannel NUSNNI MultiferroicMaterials ScanningIon-ConductanceMicroscopy Alloy CastIron BCZT Butterfly Epoxy SFAs Film Pores ElectroDeposition SetpointMode ito_film Imprint 3-hexylthiophene Tungsten Tungsten_disulfide