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TempControl CNT NTU Grain Reduction ElectrostaticForceMicroscopy CopperFoil ferromagnetic VerticalPFM AdhesionEnergy Electronics LDPE ContactModeDot FastScan Oxide PrCurve Switching Vac Solution bias_mode Microchannel MagneticPhase Conductive AFM Nanopattern PECurve Tapping Titanate Metal oxide_layer molecule lithography IcelandSpar Anneal ForceVolumeMapping AdhesionForce
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TempControl CNT NTU Grain Reduction ElectrostaticForceMicroscopy CopperFoil ferromagnetic VerticalPFM AdhesionEnergy Electronics LDPE ContactModeDot FastScan Oxide PrCurve Switching Vac Solution bias_mode Microchannel MagneticPhase Conductive AFM Nanopattern PECurve Tapping Titanate Metal oxide_layer molecule lithography IcelandSpar Anneal ForceVolumeMapping AdhesionForce