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Memory Gong Electronics Boundary Tin disulfide AmplitudeModulation ScanningSpreadingResistanceMicroscopy Pore HiVacuum mono_layer Liquid Composition TPU Wonseok Glass lithography Resistance Battery Polytetrafluoroethylene Stiffness 2d_materials Techcomp Chromium Pzt HBN Annealing Composite Thermal membrane fluorocarbon Bacteria LFM fluoroaalkane MfmPhase Ram
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Memory Gong Electronics Boundary Tin disulfide AmplitudeModulation ScanningSpreadingResistanceMicroscopy Pore HiVacuum mono_layer Liquid Composition TPU Wonseok Glass lithography Resistance Battery Polytetrafluoroethylene Stiffness 2d_materials Techcomp Chromium Pzt HBN Annealing Composite Thermal membrane fluorocarbon Bacteria LFM fluoroaalkane MfmPhase Ram