-
Boron Styrene BiFeO3 Blend Molybdenum Protein SurfaceOxidation GranadaUniv Singapore silicon_oxide Ito KPFM dichalcogenide Vanadate lithography ElectrostaticForceMicroscopy InsulatorFilm phase_change Ceramic HanyangUniv Pinpoint PFM Patterns CNT PinpointPFM Chemical Vapor Deposition Multiferroic_materials LithiumNiobate Worcester_Polytechnic_Institute Anneal DNA Calcium Moire light_emitting PMNPT Lift
Report image
If you found this image unacceptable, please let us know. We will review your report and take action if we determine this image is really unacceptable.
Li electroplating (deposition) on Cu foil
Scanning Conditions
- System : NX10 in dry room
- Scan Mode: Contact/EC AFM
- Scan Rate : 0.13 Hz
- Scan Size : 30μm×30μm
- Pixel Size : 256×256
- Cantilever : Multi75-G
- ECr : Cu Foil (Working electrode), Li metal (Reference electrode), Li (Counter electrode), 1M LiTFSI in TEGDME (Electrolyte)
- Open circuit voltage : 3.34 VLi/Li+