-
MagneticPhase LeakageCurrent Spain Device PhthalocyaninePraseodymium PolymerBlend Battery aluminum_nitride Ananth HACrystal Materials MoS2 Polyvinylidene WPlug pinpoint mode StrontiumTitanate AM_SKPM 2d_materials SingleCrystal ElectroDeposition HanyangUniv ForceVolume Solution Metal LiquidCell IndiumTinOxide Hexylthiophene Sio2 Terrace Memory Composite Thermoplastic_polyurethane ContactModeDot Layer frequency_modulation
Report image
If you found this image unacceptable, please let us know. We will review your report and take action if we determine this image is really unacceptable.
Li electroplating (deposition) on Cu foil
Scanning Conditions
- System : NX10 in dry room
- Scan Mode: Contact/EC AFM
- Scan Rate : 0.13 Hz
- Scan Size : 30μm×30μm
- Pixel Size : 256×256
- Cantilever : Multi75-G
- ECr : Cu Foil (Working electrode), Li metal (Reference electrode), Li (Counter electrode), 1M LiTFSI in TEGDME (Electrolyte)
- Open circuit voltage : 3.34 VLi/Li+