Characterization of surface roughness for different materials is known to be one of the most common applications of scanning probe microscopy both in research and production. For example, nanometer scale roughness of a silicon wafer is important for device patterning in integrated circuit (IC) manufacturing. As another application, surface quality after chemo-mechanical polishing (CMP) is key factor in determining the reliability of the final product in semiconductor production line. While AFM plays a key role in surface roughness measurement due to its sub-nanometer level resolution in Z direction, non-contact mode imaging has been essential for preserving tip life and consistency in measurements.
   During this presentation, we will demonstrate measurement of surface roughness using non-contact mode on a bare silicon wafer using our new NX system. After showing how to change cantilevers and set up the tip and sample, we will show how to perform true non-contact mode imaging. Post-analysis will be performed using our image analysis software and measurement parameters needed for roughness study and comparison will be introduced.

Presented by Dr. Ardavan Zandiatashbar
Applications Scientist, Park Systems Inc.