-
TriGlycineSulphate nanobar Mfm Hexatriacontane IMT_Bucharest Lift temperature controller AFM small_scan PMNPT P3HT Led HighAcpectRatio norganic rubber WS2 Glass Composition phase_change Polyvinylidene_fluoride CrAu ito_film Titanate LiIonBattery Piranha Optoelectonics GlassTemp CopperFoil Liquid CuParticle TungstenThinFilmDeposition PolyStylene DOE Molybdenum_disulfide Bio CalciumHydroxide
Report image
If you found this image unacceptable, please let us know. We will review your report and take action if we determine this image is really unacceptable.
Li electroplating (deposition) on Cu foil
Scanning Conditions
- System : NX10 in dry room
- Scan Mode: Contact/EC AFM
- Scan Rate : 0.13 Hz
- Scan Size : 30μm×30μm
- Pixel Size : 256×256
- Cantilever : Multi75-G
- ECr : Cu Foil (Working electrode), Li metal (Reference electrode), Li (Counter electrode), 1M LiTFSI in TEGDME (Electrolyte)
- Open circuit voltage : 3.34 VLi/Li+