Park Systems is excited to exhibit at ISTFA 2022 in Pasadena, CA. Come visit us at booth # 522

According to Moore's Law, the demand for higher performance and lower power-consumption microelectronic devices has driven semiconductor technology to shrink continuously. Furthermore, a new set of disruptive development in new structures and novel materials was introduced for the latest technologies in the nano realm. Thus, defects causing semiconductor device failures have become smaller and more elusive. To chase such defects, all failure analysis techniques and methodologies also need to be improved to keep pace with semiconductor technology. Failure characterization, fault isolation, electrical failure analysis, physical analysis, microscope imaging, and materials analysis are examples of the key challenged areas. A gap analysis has been done by the EDFAS FA Technology Roadmap Committee and is available on ASM connect. To close the gap, you can play a role, regardless of your area of expertise.

• Event Dates: Oct 30th - Nov 3rd, 2022
• Venue:  Pasadena Convention Center | Pasadena, CA
• Booth: #522

Link: ISTFA 2022